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UV laser cutting machine


Fine cutting

Small slit width: <20um~30u
High cutting precision: ≤±15um
Good cutting quality: No burrs smooth cuts

Flexible design

Exquisite appearance
Support innovative design from component level to system level
Intuitive interface simple operation

Strong adaptability

Support laser cutting drilling underlining
Can be integrated with production lines to significantly increase production efficiency
Cut and layer into blocks layers designated blocks or selected areas
  • performance parameter
  • technical parameter

● Fine cutting
• Small slit width: <20um~30u
• High cutting precision: ≤±15um
• Good cutting quality: No burrs, smooth cuts
• High processing efficiency: Direct driving mobile double-drive system, one-time cut through the single side wall

● Strong adaptability
• Support laser cutting, drilling, underlining
• Can be integrated with production line: fixed beam mechanism and flying light path design, easy access to production line, can be equipped with special loading and unloading and IN-LINE system according to production requirements, to achieve full automation of production, greatly improve production efficiency, is designed for FPC And PCB processing tailor-made equipment.
• Efficient and fast FPC / PCB appearance cutting, drilling and covering film window opening, fingerprint identification chip cutting, TF memory card sub-board, mobile phone camera module cutting and other applications.
• Divided into blocks, layers, designated blocks or selected areas and cut directly. The cutting edges are neat and smooth, smooth without burrs and without overflowing glue. Products can be arranged in a matrix for automatic positioning and cutting, especially suitable for cutting of fine, difficult and complicated patterns.

● Flexible design
• Exquisite appearance
• Flexible function collocation, support personalized function customization
• Support innovative design from component level to system level
• Intuitive interface, simple operation

● Technical certification
• CE
• ISO9001

Effective stroke 400mm/s (X) ; 350mm/s (Y) ; 50mm/s (Z) ;
Positioning accuracy ±0.004mm;
Repositioning accuracy ±0.002mm;
Stitching accuracy ±20um;
Processing material PI plastic carbon fiber copper foil super metal composite materials etc.
Application area Particularly suitable for PCB cutting sub-board FPC cutting cover film cutting and opening silicon wafer cutting / scoring ceramic cutting / scoring / drilling glass cutting / scoring / hairing fingerprint identification chip PET film PI Film cutting ultra-thin metal cutting such as copper foil drilling carbon fiber composite material cutting etc.
Laser type UV laser;
Wavelength 355nm;
Power 15W;
Focus spot size 20um;
Power supply 220V±10%, 50Hz; AC 15A(main circuit breaker);
Compatible file format DXF、DWG;
Equipment size About 1400mmX1250mmX1850mm;
Equipment eight About 1500Kg;


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